加快碳化硅芯片和電力電子器件的商業(yè)化發(fā)展Accelerating Commercialization of SiC Chips and Power ElectronicsVictor VELIADIS美國PowerAmerica執(zhí)行董事兼CTO、ICSCRM 2024 大會主席、北卡羅萊納州立大學(xué)教授、IEEE寬禁帶功率半導(dǎo)體技術(shù)路線圖委員會(ITRW)主席Victor VELIADISExecutiveDirector and CTO of PowerAmerica, Chair of ICSCRM 2024, Professor of North Carolina State Universityand Chair of ITRW ( IEEE Wide Ban
大直徑碳化硅外延市場發(fā)展與挑戰(zhàn)Development and Challenges of Large Diameter Silicon Carbide Epitaxial張國良河北普興電子科技股份有限公司市場總監(jiān)ZHANG GuoliangMarketing Director of Hebei Pushing Electronic Technology Co., LTD
碳化硅單晶缺陷研究及產(chǎn)業(yè)化進(jìn)展Research and Industrialization Progress of SiC Single Crystal Defects陳秀芳山東大學(xué)教授、南砂晶圓董事CHEN XiufangProfessor of Shandong University, Board Director of Guangzhou Summit Crystal Semiconductor Co.,Ltd
提拉式物理氣相傳輸法制備碳化硅單晶Single-crystal 4H Silicon Carbide Grown with the Method of Pulling Physical Vapor Transport皮孝東浙江大學(xué)教授PI XiaodongProfessor of Zhejiang University
SiC MOS在新能源汽車充電樁中的技術(shù)進(jìn)展及應(yīng)用田亮南瑞聯(lián)研半導(dǎo)體有限責(zé)任公司碳化硅產(chǎn)品線負(fù)責(zé)人TIAN Liang Leader of SiC Product for NARI-GEIRI semiconductor co.Ltd
電熱應(yīng)力下碳化硅功率MOSFET損傷的多尺度探測表征方法Multi-scale Detection and Characterization of SiC Power MOSFET Damage under Electro-thermal Stress劉斯揚(yáng)東南大學(xué)教授LIU SiyangProfessor of Southeast University
碳化硅及氮化鎵功率器件在數(shù)據(jù)中心AC-DC電源上的應(yīng)用及展望The application and prospect of wide band gap devices in AC-DC power supply in data center董慨臺達(dá)電子高階客制電源事業(yè)部中國區(qū)總監(jiān)Dong KaiRD Director of CDBU, Delta Electronics
基于P區(qū)反序摻雜策略的高效碳化硅結(jié)勢壘肖特基二極管的研究High-Performance 1200 V/ 20 A 4H-SiC JBS Diodes with Retrograde P-Implants Strategy張園覽復(fù)旦大學(xué)Yuan-Lan ZHANGFudan University
第三代半導(dǎo)體碳化硅器件產(chǎn)業(yè)化關(guān)鍵技術(shù)及發(fā)展進(jìn)展The key technology and development progress of the Wide Band-gap semiconductor silicon carbide device industrialization鈕應(yīng)喜蕪湖啟迪半導(dǎo)體有限公司研發(fā)總監(jiān)NIU YingxiRD Director of Wuhu Advanced Semiconductor Manufacturing Co.,ltd
碳化硅芯片會在 2025-2030 年被電動汽車廣泛采用的可能性探討The Question: Will SiC chips be widely adopted by Electric Vehicles in 2025-2030?Anant AGARWAL美國俄亥俄州立大學(xué)教授、IEEE會士Anant AGARWALProfessorofThe Ohio State University, IEEE Fellow
碳化硅大規(guī)模商業(yè)化：現(xiàn)狀與障礙SiC Mass Commercialization: Present Status and BarriersVictor VELIADISChief Officer and CTO ofPower America, Professor of North Carolina State UniversityVictor VELIADIS美國電力首席執(zhí)行官兼首席技術(shù)官、北卡羅萊納州立大學(xué)教授
Band offsets and solar-blind photoresponse of -Ga2O3/4H-SiC heterojunctionAuthor: Jiaying Shen, Mingfeng Gan, Qingyi Zhang, Yangyong Tao, Zhenping Wu, Weihua TangInstitute: State Key Laboratory of Information Photonics and Optical CommunicationsSchool of Science, Beijing University of Posts and Telecommunications
